Integrated Processing System
IPS 602
Backend System for SMD DIP/IC
Tube to Tube/Tape Handling
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Key Features
Capacity up to 16,000 uph
Bulk (Bowl) Feeding
Pre-Testing - 4 Modules
Lead Forming (optional)
Laser Marking
Mark Inspection
Re-Testing - 2 Modules
3D Lead (Coplanarity) Inspection
Manual Tube Loader - 16 Modules
Automatic Tube Loader - 2 Modules
Taping - 4 Modules
Download Introductory Product Brochure |
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