Integrated Processing System
IPS 352
New Millenium for Semiconductor
Testing Technology
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Key Features
Capacity up to 28,800 uph
Incoming Material Inspection
Tie Bar Removal
Lead Trimming
Pre-Testing - 6 Modules
Laser Marking
Mark Inspection
Lead Forming
Re-Testing - 2 Modules
3D Lead (Coplanarity) Inspection
or 5-side Inspection
Bulk (Bin) Sorting - 7 Modules
Taping - 4 Modules
Download Introductory Product Brochure |
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